Liquid-ejection head and method for manufacturing liquid-ejection head substrate
    3.
    发明授权
    Liquid-ejection head and method for manufacturing liquid-ejection head substrate 有权
    液体喷射头和液体喷射头基板的制造方法

    公开(公告)号:US08366950B2

    公开(公告)日:2013-02-05

    申请号:US12204802

    申请日:2008-09-05

    IPC分类号: G01D15/00

    摘要: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

    摘要翻译: 提供一种制造包括具有用于供应液体的供给口的硅基板的液体喷射头基板的方法。 该方法包括:在硅衬底的表面上形成蚀刻掩模层,该蚀刻掩模层在与供给口对应的部分中具有开口; 通过在蚀刻掩模层中的开口各向异性蚀刻硅衬底,在硅衬底的表面中形成第一凹槽; 形成在所述硅衬底的所述第一凹部的表面中朝向所述硅衬底的另一表面延伸的第二凹部; 以及通过从设置有所述第二凹部的表面各向异性地蚀刻所述硅衬底而形成所述供给口。

    LIQUID-EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID-EJECTION HEAD SUBSTRATE
    4.
    发明申请
    LIQUID-EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID-EJECTION HEAD SUBSTRATE 有权
    液体喷射头及其制造方法

    公开(公告)号:US20090065474A1

    公开(公告)日:2009-03-12

    申请号:US12204802

    申请日:2008-09-05

    IPC分类号: B41J2/16

    摘要: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

    摘要翻译: 提供一种制造包括具有用于供应液体的供给口的硅基板的液体喷射头基板的方法。 该方法包括:在硅衬底的表面上形成蚀刻掩模层,该蚀刻掩模层在与供给口对应的部分中具有开口; 通过在蚀刻掩模层中的开口各向异性蚀刻硅衬底,在硅衬底的表面中形成第一凹槽; 形成在所述硅衬底的所述第一凹部的表面中朝向所述硅衬底的另一表面延伸的第二凹部; 以及通过从设置有所述第二凹部的表面各向异性地蚀刻所述硅衬底而形成所述供给口。

    Manufacturing method of substrate for ink jet head and manufacturing method of ink jet recording head
    5.
    发明授权
    Manufacturing method of substrate for ink jet head and manufacturing method of ink jet recording head 失效
    喷墨头用基板的制造方法和喷墨记录头的制造方法

    公开(公告)号:US07727411B2

    公开(公告)日:2010-06-01

    申请号:US11681411

    申请日:2007-03-02

    IPC分类号: B41J2/16

    摘要: The present invention provides a manufacturing method of a substrate for an ink jet head including forming an ink supply opening to a silicon substrate, including (a) forming, at the back surface of the silicon substrate, an etching mask layer, which has an opening that is asymmetric with a center line, extending in the longitudinal direction, of an area on the surface of the silicon substrate where the ink supply opening is to be formed; (b) forming a non-through hole on the silicon substrate via the opening on the etching mask layer; and (c) forming the ink supply opening by performing a crystal anisotropic etching to the silicon substrate from the opening.

    摘要翻译: 本发明提供一种喷墨头用基板的制造方法,其特征在于,包括:(a)在所述硅基板的背面形成有具有开口部的蚀刻掩模层 在硅基板的要形成供墨口的表面上的区域的沿长度方向延伸的中心线是不对称的; (b)通过蚀刻掩模层上的开口在硅衬底上形成非通孔; 和(c)通过从开口对硅衬底进行结晶各向异性蚀刻来形成供墨口。

    Circuit board for ink jet head, method of manufacturing the same, and ink jet head using the same
    6.
    发明授权
    Circuit board for ink jet head, method of manufacturing the same, and ink jet head using the same 有权
    用于喷墨头的电路板,其制造方法和使用其的喷墨头

    公开(公告)号:US07681993B2

    公开(公告)日:2010-03-23

    申请号:US11203129

    申请日:2005-08-15

    IPC分类号: B41J2/05

    摘要: An ink jet head circuit board is provided which has heaters to generate thermal energy for ejecting ink as they are energized. This circuit board is so constructed as to reduce wire resistances for the heaters while at the same time preventing an increase in the size of the board and realizing a high-density integration of the heaters required for high resolution printing. This construction is made possible by forming electrode wires of first and second electrode wire layers to reduce an area that the wire patterns for the heater occupy on the circuit board. In reducing the effective thickness of protective insulation layer formed on the heater to prevent a possible degradation of thermal efficiency, one of the protective insulation layers over the electrode wires is removed from the heater, depending on the thickness of the electrode wires.

    摘要翻译: 提供了一种喷墨头电路板,其具有加热器以产生用于在通电时喷射墨水的热能。 该电路板被构造成降低加热器的导线电阻,同时防止板的尺寸增加,并实现高分辨率印刷所需的加热器的高密度集成。 通过形成第一电极线层和第二电极线层的电极线,能够减小加热器的电线图案在电路基板上的占有面积。 在减小加热器上形成的保护绝缘层的有效厚度以防止热效率可能降低的情况下,根据电极线的厚度,从加热器上除去电极线上的保护绝缘层之一。

    Ink jet head circuit board, method of manufacturing the same and ink jet head using the same
    8.
    发明授权
    Ink jet head circuit board, method of manufacturing the same and ink jet head using the same 有权
    喷墨头电路板,其制造方法和使用其的喷墨头

    公开(公告)号:US07641316B2

    公开(公告)日:2010-01-05

    申请号:US11203130

    申请日:2005-08-15

    IPC分类号: B41J2/05

    摘要: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board reduces areas of the heaters to achieve higher printing resolution and image quality. This board also prevents a degradation of thermal energy efficiency and reduces power consumption. The protective insulation layer for the electrode wire layer is formed of two layers and one of the two layers is removed from above the heater to improve the heat energy efficiency. The resistor layer is deposited over the electrode wire layer. The patterning for removing the protective insulation layer is done in a wider range than a gap of the electrode wire layer, the gap being used to form the heater. Further, by forming the electrode wires in two layers, a possible reduction in an effective bubble generation area of the heater can be prevented.

    摘要翻译: 提供了一种喷墨头电路板,其具有加热器,以便在通电时产生用于喷墨的热能。 该电路板减少了加热器的面积,以实现更高的打印分辨率和图像质量。 该板还可防止热能效率的降低并降低功耗。 用于电极线层的保护绝缘层由两层形成,并且从加热器上方移除两层中的一层以提高热能效率。 电阻层沉积在电极丝层上。 用于去除保护绝缘层的图案在比电极丝层的间隙更宽的范围内进行,该间隙用于形成加热器。 此外,通过将电极线形成为两层,可以防止加热器的有效气泡产生面积的降低。

    Ink jet head circuit board, method of manufacturing the same and ink jet head using the same
    10.
    发明申请
    Ink jet head circuit board, method of manufacturing the same and ink jet head using the same 有权
    喷墨头电路板,其制造方法和使用其的喷墨头

    公开(公告)号:US20060033779A1

    公开(公告)日:2006-02-16

    申请号:US11202079

    申请日:2005-08-12

    IPC分类号: B41J2/04 B41J2/05

    摘要: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection. This board has the heaters formed with high precision to reduce their areas. It has provisions to protect the electrode wires against corrosion and prevent a progress of corrosion. The substrate is deposited with the thin first electrodes made of a corrosion resistant metal. Over the first electrodes the second electrodes made of aluminum are formed. The second electrodes are deposited with a resistor layer. The heater is formed in the gap between the first electrodes. With this construction, the heaters are formed without large dimensional variations among them. Should a defect occur in a protective layer above or near the heaters, a progress of corrosion can effectively be prevented because the material of the resistor layer is more resistant to encroachment than aluminum and the first electrodes are corrosion resistant.

    摘要翻译: 提供一种喷墨头电路板,其具有用于产生用于喷墨的热能的加热器。 该板具有高精度形成的加热器,以减少其面积。 它具有保护电极丝免受腐蚀和防止腐蚀进行的规定。 用由抗腐蚀金属制成的薄的第一电极沉积衬底。 在第一电极上形成由铝制成的第二电极。 第二电极沉积有电阻层。 加热器形成在第一电极之间的间隙中。 利用这种结构,在它们之间形成没有大尺寸变化的加热器。 如果在加热器上方或附近的保护层中发生缺陷,则可以有效地防止腐蚀进行,因为电阻层的材料比铝更耐侵蚀,并且第一电极具有耐腐蚀性。