发明授权
- 专利标题: Semiconductor device and fabrication method
- 专利标题(中): 半导体器件及其制造方法
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申请号: US13558467申请日: 2012-07-26
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公开(公告)号: US08367532B2公开(公告)日: 2013-02-05
- 发明人: Anton Mauder , Hans-Joachim Schulze , Frank Hille , Holger Schulze , Manfred Pfaffenlehner , Carsten Schäffer , Franz-Josef Niedernostheide
- 申请人: Anton Mauder , Hans-Joachim Schulze , Frank Hille , Holger Schulze , Manfred Pfaffenlehner , Carsten Schäffer , Franz-Josef Niedernostheide
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: SpryIP, LLC
- 优先权: DE102004047749 20040930
- 主分类号: H01L21/265
- IPC分类号: H01L21/265
摘要:
A semiconductor device in one embodiment has a first connection region, a second connection region and a semiconductor volume arranged between the first and second connection regions. Provision is made, within the semiconductor volume, in the vicinity of the second connection region, of a field stop zone for spatially delimiting a space charge zone that can be formed in the semiconductor volume, and of an anode region adjoining the first connection region. The dopant concentration profile within the semiconductor volume is configured such that the integral of the ionized dopant charge over the semiconductor volume, proceeding from an interface of the anode region which faces the second connection region, in the direction of the second connection region, reaches a quantity of charge corresponding to the breakdown charge of the semiconductor device only near the interface of the field stop zone which faces the second connection region.
公开/授权文献
- US20120315747A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD 公开/授权日:2012-12-13
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