Invention Grant
- Patent Title: Light emitting diode package and method of manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US11826248Application Date: 2007-07-13
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Publication No.: US08368097B2Publication Date: 2013-02-05
- Inventor: Hyun Jun Kim , Chang Hwan Choi , Jong Myeon Lee , Dong Woohn Kim , Won Ha Moon
- Applicant: Hyun Jun Kim , Chang Hwan Choi , Jong Myeon Lee , Dong Woohn Kim , Won Ha Moon
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2006-0127324 20061213
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.
Public/Granted literature
- US20080142822A1 Light emitting diode package and method of manufacturing the same Public/Granted day:2008-06-19
Information query
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