A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, increasing rigidity of the package assembly. In one embodiment, the package comprises a surface-mount device a casing with a cavity extending into the interior of the casing from a first main surface is provided. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of light emitting devices (LEDs). Electrically conductive parts, separate from parts carrying the LEDs have a connection pad, wherein the LEDs are electrically coupled to a connection pad, such as by a wire bond. This lead frame arrangement allows for a respective electrical signal can be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.