Invention Grant
US08377733B2 Antireflective layer for backside illuminated image sensor and method of manufacturing same
有权
用于背面照明图像传感器的抗反射层及其制造方法
- Patent Title: Antireflective layer for backside illuminated image sensor and method of manufacturing same
- Patent Title (中): 用于背面照明图像传感器的抗反射层及其制造方法
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Application No.: US12890913Application Date: 2010-09-27
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Publication No.: US08377733B2Publication Date: 2013-02-19
- Inventor: Chih-Hui Huang , Cheng-Yuan Tsai , Yeur-Luen Tu , Chia-Shiung Tsai , Dun-Nian Yaung , Jen-Cheng Liu
- Applicant: Chih-Hui Huang , Cheng-Yuan Tsai , Yeur-Luen Tu , Chia-Shiung Tsai , Dun-Nian Yaung , Jen-Cheng Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The present disclosure provides an image sensor device that exhibits improved quantum efficiency. For example, a backside illuminated (BSI) image sensor device is provided that includes a substrate having a front surface and a back surface; a light sensing region disposed at the front surface of the substrate; and an antireflective layer disposed over the back surface of the substrate. The antireflective layer has an index of refraction greater than or equal to about 2.2 and an extinction coefficient less than or equal to about 0.05 when measured at a wavelength less than 700 nm.
Public/Granted literature
- US20120038015A1 ANTIREFLECTIVE LAYER FOR BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING SAME Public/Granted day:2012-02-16
Information query
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