发明授权
- 专利标题： Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
- 专利标题（中）： 集成电路堆叠封装前体和堆叠的封装器件和系统
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申请号： US13244364申请日： 2011-09-24
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公开(公告)号： US08377746B2公开(公告)日： 2013-02-19
- 发明人: Peter R. Harper , Kenneth Maggio
- 申请人： Peter R. Harper , Kenneth Maggio
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48
摘要：
A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.
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