公开(公告)号：US12053165B1

公开(公告)日：2024-08-06

申请号：US18541529

申请日：2023-12-15

申请人： Denise Angela Maggio ,  Alexander Daniel Maggio ,  Austin Kenneth Maggio

发明人： Denise Angela Maggio ,  Alexander Daniel Maggio ,  Austin Kenneth Maggio

IPC分类号： A61B10/00

CPC分类号： A61B10/007

摘要： A urine collection system provides a method of collecting urine in a safe and ergonomic manner having a handle that extends from the urine collector to enable much more ergonomic positioning during urine collection. The handle is detachable from the urine collector. Also, the urine collection system includes a lid that is configured to fit over the collector opening of the urine collector to prevent spilling of the urine, or contact of the urine during processing. The urine collector includes a container having a collection funnel portion forming the collector opening to the urine collector and a retainer portion, coupled to the collection funnel portion. The collection funnel portion may be detachable from the retainer portion and the retainer portion may be a cup with a threaded lid that is removed to attach the cup to the collection funnel portion.

公开(公告)号：US20120015478A1

公开(公告)日：2012-01-19

申请号：US13244364

申请日：2011-09-24

申请人： Peter R. Harper ,  Kenneth Maggio

发明人： Peter R. Harper ,  Kenneth Maggio

IPC分类号： H01L21/60 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L23/5382 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

摘要翻译： 包装封装（POP）包装前体及其包装的装置和系统包括包括导电层和顶表面的电子基板。 上表面的第一部分附着有IC芯片。 顶表面的第二部分在IC芯片的相对侧上具有多个第一附接焊盘，用于电耦合到IC芯片顶部上的第一电子器件。 顶表面的至少第三部分相对于第一和第二部分横向定位。 第三部分包括用于电耦合到至少第二电子设备的多个第二附接焊盘。 所述导电层中的至少一个包括耦合迹线，所述耦合迹线将所述多个第二附着焊盘中的至少一个耦合到所述IC裸片和/或所述多个第一附接焊盘中的一个或多个。

公开(公告)号：US06606004B2

公开(公告)日：2003-08-12

申请号：US09838451

申请日：2001-04-19

申请人： Robert B Staszewski ,  Kenneth Maggio ,  Dirk Leipold

发明人： Robert B Staszewski ,  Kenneth Maggio ,  Dirk Leipold

IPC分类号： H03L700

CPC分类号： H03L7/093 ,  H03L7/0991 ,  H03L2207/50

摘要： A technique of time dithering a fully digitally-controlled oscillator (DCO) tuning input employs a shift register 1306 and a multiplexer 1308 responsive to a sigma-delta modulated delay control to minimize spurious tones generated by a DCO 200. The shift register 1306 is clocked via a divided-down high-frequency reference provided by the DCO 200 output signal. The multiplexer 1308 is clocked via a frequency reference that is reclocked and synchronized to the DCO 200 output signal. The multiplexer 1308 output is thus time dithered in response to a delay control to minimize perturbations caused by switching.

公开(公告)号：US08377746B2

公开(公告)日：2013-02-19

申请号：US13244364

申请日：2011-09-24

申请人： Peter R. Harper ,  Kenneth Maggio

发明人： Peter R. Harper ,  Kenneth Maggio

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/3128 ,  H01L23/5382 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

摘要翻译： 包装封装（POP）包装前体及其包装的装置和系统包括包括导电层和顶表面的电子基板。 上表面的第一部分附着有IC芯片。 顶表面的第二部分在IC芯片的相对侧上具有多个第一附接焊盘，用于电耦合到IC芯片顶部上的第一电子器件。 顶表面的至少第三部分相对于第一和第二部分横向定位。 第三部分包括用于电耦合到至少第二电子设备的多个第二附接焊盘。 所述导电层中的至少一个包括耦合迹线，所述耦合迹线将所述多个第二附着焊盘中的至少一个耦合到所述IC裸片和/或所述多个第一附接焊盘中的一个或多个。

公开(公告)号：US06809598B1

公开(公告)日：2004-10-26

申请号：US09695516

申请日：2000-10-24

申请人： Robert B. Staszewski ,  Dirk Leipold ,  Kenneth Maggio

发明人： Robert B. Staszewski ,  Dirk Leipold ,  Kenneth Maggio

IPC分类号： H03L706

CPC分类号： H04B1/7156 ,  H03C3/0925 ,  H03C3/0941 ,  H03C3/0966 ,  H03C3/0975 ,  H03L7/1806 ,  H03L2207/50 ,  H04B2001/71566 ,  H04L27/12

摘要： A phase-domain digital PLL loop is implemented using a hybrid of predictive and closed-loop architecture that allows direct DCO oscillator transmit modulation in the GFSK modulation scheme of “BLUETOOTH” or GSM, as well as the chip phase modulation of the 802.11b or Wideband-CDMA. The current gain of the DCO oscillator is predicted by observing past phase error responses to previous DCO corrections. DCO control is then augmented with the “open-loop” instantaneous frequency jump estimate of the new frequency control word.

摘要翻译： 使用预测和闭环架构的混合来实现相域数字PLL环路，其允许在“蓝牙”或GSM的GFSK调制方案中直接DCO振荡器发送调制，以及802.11b的芯片相位调制或 宽带CDMA。 DCO振荡器的当前增益是通过观察对先前DCO校正的过去相位误差响应来预测的。 然后用新的频率控制字的“开环”瞬时频率跳跃估计来增加DCO控制。

公开(公告)号：US20090206455A1

公开(公告)日：2009-08-20

申请号：US12388976

申请日：2009-02-19

申请人： PETER R. HARPER ,  KENNETH MAGGIO

发明人： PETER R. HARPER ,  KENNETH MAGGIO

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L21/98

CPC分类号： H01L23/3128 ,  H01L23/5382 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

摘要翻译： 包装封装（POP）包装前体及其包装的装置和系统包括包括导电层和顶表面的电子基板。 上表面的第一部分附着有IC芯片。 顶表面的第二部分在IC芯片的相对侧上具有多个第一附接焊盘，用于电耦合到IC芯片顶部上的第一电子器件。 顶表面的至少第三部分相对于第一和第二部分横向定位。 第三部分包括用于电耦合到至少第二电子设备的多个第二附接焊盘。 所述导电层中的至少一个包括将所述多个第二附着焊盘中的至少一个耦合到所述IC裸片和/或所述多个第一附接焊盘中的一个或多个的耦合迹线。

公开(公告)号：US08049320B2

公开(公告)日：2011-11-01

申请号：US12388976

申请日：2009-02-19

申请人： Peter R. Harper ,  Kenneth Maggio

发明人： Peter R. Harper ,  Kenneth Maggio

IPC分类号： H01L23/02 ,  H01L23/34

CPC分类号： H01L23/3128 ,  H01L23/5382 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.

摘要翻译： 包装封装（POP）包装前体及其包装的装置和系统包括包括导电层和顶表面的电子基板。 上表面的第一部分附着有IC芯片。 顶表面的第二部分在IC芯片的相对侧上具有多个第一附接焊盘，用于电耦合到IC芯片顶部上的第一电子器件。 顶表面的至少第三部分相对于第一和第二部分横向定位。 第三部分包括用于电耦合到至少第二电子设备的多个第二附接焊盘。 所述导电层中的至少一个包括将所述多个第二附着焊盘中的至少一个耦合到所述IC裸片和/或所述多个第一附接焊盘中的一个或多个的耦合迹线。

公开(公告)号：US20050264333A1

公开(公告)日：2005-12-01

申请号：US11195060

申请日：2005-08-02

申请人： Robert Staszewski ,  Dirk Leipold ,  Kenneth Maggio

发明人： Robert Staszewski ,  Dirk Leipold ,  Kenneth Maggio

IPC分类号： H03F1/02 ,  H03F1/06 ,  H03F3/217 ,  H03K3/00 ,  H03K3/017 ,  H03K5/06 ,  H03K7/02 ,  H04B1/04

CPC分类号： H03F1/02 ,  H03F1/0205 ,  H03F3/217 ,  H03F3/2171 ,  H03F3/2176 ,  H03F2200/331 ,  H03K5/06 ,  H03K7/02 ,  H04B1/0483 ,  H04B2001/0491

摘要： Efficient PAM transmit modulation is provided by a PAM modulator that includes an oscillator (404) that provides a clock signal, CKV, (408). The clock signal 408 and a delayed version (CKV_DLY) 420 of the clock signal are provided to a logic gate (414). The output of logic gate (414) is used as a power amplifier input signal (PA_IN) for radio frequency power amplifier (416). Depending on the relative time delay of the CKV clock signal (408) and the CKV_DLY delayed clock signal (420), the timing and duty cycle of the logic gate (414) duty cycle can be controlled. The duty cycle or pulse-width variation affects the turn-on time of the power amplifier (416); thereby establishing the RF output amplitude.