Invention Grant
- Patent Title: Insulated gate type semiconductor device and method for fabricating the same
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Application No.: US13396816Application Date: 2012-02-15
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Publication No.: US08377775B2Publication Date: 2013-02-19
- Inventor: Hiroshi Inagawa , Nobuo Machida , Kentaro Oishi
- Applicant: Hiroshi Inagawa , Nobuo Machida , Kentaro Oishi
- Applicant Address: JP Kawasaki-shi JP Takasaki-shi
- Assignee: Renesas Electronics Corporation,Hitachi Tobu Semiconductor, Ltd.
- Current Assignee: Renesas Electronics Corporation,Hitachi Tobu Semiconductor, Ltd.
- Current Assignee Address: JP Kawasaki-shi JP Takasaki-shi
- Agency: Miles and Stockbridge P.C.
- Priority: JP2001-042352 20010219
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
In an insulated-gate type semiconductor device in which a gate-purpose conductive layer is embedded into a trench which is formed in a semiconductor substrate, and a source-purpose conductive layer is provided on a major surface of the semiconductor substrate, a portion of a gate pillar which is constituted by both the gate-purpose conductive layer and a cap insulating film for capping an upper surface of the gate-purpose conductive layer is projected from the major surface of the semiconductor substrate; a side wall spacer is provided on a side wall of the projected portion of the gate pillar; and the source-purpose conductive layer is connected to a contact region of the major surface of the semiconductor substrate, which is defined by the side wall spacer.
Public/Granted literature
- US20120142156A1 INSULATED GATE TYPE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-06-07
Information query
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