Invention Grant
- Patent Title: Methods and apparatus for depositing copper on tungsten
- Patent Title (中): 在钨上沉积铜的方法和设备
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Application No.: US13437531Application Date: 2012-04-02
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Publication No.: US08377824B1Publication Date: 2013-02-19
- Inventor: Jonathan Reid , Sesha Varadarajan , Ugur Emekli
- Applicant: Jonathan Reid , Sesha Varadarajan , Ugur Emekli
- Applicant Address: US CA Fremont
- Assignee: Novellus Systems, Inc.
- Current Assignee: Novellus Systems, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
Apparatus and methods for depositing copper on tungsten are presented. The invention finds particular use in the semiconductor industry for depositing copper seed layers onto fields or through silicon vias having tungsten barrier layers, both reducing cost and complexity of existing methods.
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