发明授权
- 专利标题： Wiring board having lead pin, and lead pin
- 专利标题（中）： 接线板有引脚和引脚
-
申请号： US12633443申请日： 2009-12-08
-
公开(公告)号： US08379402B2公开(公告)日： 2013-02-19
- 发明人: Kazuhiro Oshima , Yoshikazu Hirabayashi , Shigeo Nakajima , Yoshitaka Matsushita
- 申请人： Kazuhiro Oshima , Yoshikazu Hirabayashi , Shigeo Nakajima , Yoshitaka Matsushita
- 申请人地址： JP Nagano-Shi
- 专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人： Shinko Electric Industries Co., Ltd.
- 当前专利权人地址： JP Nagano-Shi
- 代理机构： Rankin, Hill & Clark LLP
- 优先权： JP2008-313966 20081210
- 主分类号： H01R9/00
- IPC分类号： H01R9/00
摘要：
A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.
公开/授权文献
- US20100139970A1 WIRING BOARD HAVING LEAD PIN, AND LEAD PIN 公开/授权日：2010-06-10
信息查询
