Invention Grant
US08384186B2 Power semiconductor device with new guard ring termination design and method for producing same 有权
具有新保护环端接设计的功率半导体器件及其制造方法

Power semiconductor device with new guard ring termination design and method for producing same
Abstract:
A power semiconductor device, such as a power diode, and a method for producing such a device, are disclosed. The device includes a first layer of a first conductivity type, a second layer of a second conductivity type arranged in a central region on a first main side of the first layer, a third electrically conductive layer arranged on the second layer, and a fourth electrically conductive layer arranged on the first layer at a second main side opposite to the first main side. A junction termination region surrounds the second layer with self-contained sub-regions of the second conductivity type. A spacer region is arranged between the second layer and the junction termination region and includes a self-contained spacer sub-region of the second conductivity type which is electrically disconnected from the second layer. This spacer sub-region has a width for enabling a reliable alignment of a shadow mask during an ion implantation such that an implanted lifetime control region having carrier lifetime reducing defects may be restricted to a central area while no such defects are implanted into the junction termination region to improve electrical characteristics.
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