发明授权
- 专利标题： Semiconductor equipment and method of manufacturing the same
- 专利标题（中）： 半导体设备及其制造方法
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申请号： US13173647申请日： 2011-06-30
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公开(公告)号： US08384212B2公开(公告)日： 2013-02-26
- 发明人: Nobuyuki Otsuka , Manabu Yanagihara , Shuichi Nagai , Daisuke Ueda
- 申请人： Nobuyuki Otsuka , Manabu Yanagihara , Shuichi Nagai , Daisuke Ueda
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, LLP
- 优先权： JP2010-053874 20100310
- 主分类号： H01L23/10
- IPC分类号： H01L23/10
摘要：
To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a top surface of the stem, inside the sealed container. The semiconductor chip is electrically connected to a lead provided to the stem, the stem peripheral portion, which is of a material that is different from the material of stem and the same as the material of the sealed container, is bonded along a periphery of the stem, and the sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether.
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