Invention Grant
- Patent Title: Electrostatic bonding of a die substrate to a package substrate
- Patent Title (中): 模具基板与封装基板的静电接合
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Application No.: US12908047Application Date: 2010-10-20
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Publication No.: US08384269B2Publication Date: 2013-02-26
- Inventor: David Martin , John Choy
- Applicant: David Martin , John Choy
- Applicant Address: SG Singapore
- Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H03H9/15
- IPC: H03H9/15
Abstract:
A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.
Public/Granted literature
- US20120098625A1 ELECTROSTATIC BONDING OF A DIE SUBSTRATE TO A PACKAGE SUBSTRATE Public/Granted day:2012-04-26
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