Invention Grant
US08384395B2 Circuit for controlling temperature and enabling testing of a semiconductor chip
有权
用于控制温度的电路，并能够测试半导体芯片
- Patent Title: Circuit for controlling temperature and enabling testing of a semiconductor chip
- Patent Title (中): 用于控制温度的电路，并能够测试半导体芯片
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Application No.: US12774730Application Date: 2010-05-06
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Publication No.: US08384395B2Publication Date: 2013-02-26
- Inventor: Ravindra Karnad , Sudheer Prasad , Ram A Jonnavithula
- Applicant: Ravindra Karnad , Sudheer Prasad , Ram A Jonnavithula
- Applicant Address: US TX Dallas
- Assignee: Texas Instrument Incorporated
- Current Assignee: Texas Instrument Incorporated
- Current Assignee Address: US TX Dallas
- Agent Robert D. Marshall, Jr.; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01H31/02
- IPC: H01H31/02
Abstract:
A circuit for controlling temperature of a semiconductor chip includes a first heating element that is built into the semiconductor chip. The first heating element generates heat to increase the temperature of the semiconductor chip. The chip also includes a temperature controller that is coupled to the first heating element and built into the semiconductor chip. The temperature controller controls the temperature to enable testing of the semiconductor chip at a desired temperature.
Public/Granted literature
- US20110273186A1 CIRCUIT FOR CONTROLLING TEMPERATURE AND ENABLING TESTING OF A SEMICONDUCTOR CHIP Public/Granted day:2011-11-10
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