公开(公告)号：US08384395B2

公开(公告)日：2013-02-26

申请号：US12774730

申请日：2010-05-06

Applicant: Ravindra Karnad ,  Sudheer Prasad ,  Ram A Jonnavithula

Inventor： Ravindra Karnad ,  Sudheer Prasad ,  Ram A Jonnavithula

IPC: H01H31/02

CPC classification number: G01R31/2875 ,  G01R31/2856

Abstract: A circuit for controlling temperature of a semiconductor chip includes a first heating element that is built into the semiconductor chip. The first heating element generates heat to increase the temperature of the semiconductor chip. The chip also includes a temperature controller that is coupled to the first heating element and built into the semiconductor chip. The temperature controller controls the temperature to enable testing of the semiconductor chip at a desired temperature.

Abstract translation: 用于控制半导体芯片的温度的电路包括内置在半导体芯片中的第一加热元件。 第一加热元件产生热量以增加半导体芯片的温度。 芯片还包括耦合到第一加热元件并内置于半导体芯片中的温度控制器。 温度控制器控制温度以使半导体芯片能够在期望的温度下进行测试。