Invention Grant
US08388208B2 Method and structure for uniforming light emitted from backlight module
有权
使从背光模块发出的光均匀化的方法和结构
- Patent Title: Method and structure for uniforming light emitted from backlight module
- Patent Title (中): 使从背光模块发出的光均匀化的方法和结构
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Application No.: US12826687Application Date: 2010-06-30
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Publication No.: US08388208B2Publication Date: 2013-03-05
- Inventor: Ming Huang Wen , Chun Pin Chang , Chan Chang Ni , Tsung Yung Hung , Chung Lin Tsai
- Applicant: Ming Huang Wen , Chun Pin Chang , Chan Chang Ni , Tsung Yung Hung , Chung Lin Tsai
- Applicant Address: TW Chung-Li
- Assignee: Global Lighting Technologies (Taiwan) Inc.
- Current Assignee: Global Lighting Technologies (Taiwan) Inc.
- Current Assignee Address: TW Chung-Li
- Agency: Lin & Associates IP, Inc.
- Priority: TW98139687A 20091123; TW99113526A 20100428
- Main IPC: F21V8/00
- IPC: F21V8/00 ; F21V7/04 ; F21V7/05

Abstract:
A method and a structure for improving the uniformity of light emitted from a backlight module are provided. In accordance with the present invention, a plurality of optical microstructures are intermittently distributed on an LGP of a backlight module. Each of the microstructures further includes a plurality of optical sub-microstructures. The optical microstructures and the optical sub-microstructures are distributed on the LGP with varied distribution intensities in three dimensions, such that at where the optical microstructures and the optical sub-microstructures are distributed with a larger distribution intensities the LGP refracts and reflects more light, and at where the optical microstructures and the optical sub-microstructures are distributed with a smaller distribution intensities the LGP refracts and reflects less light. In such a way, by designing particular distribution intensities of the optical microstructures and the optical sub-microstructures, the light emitted from the LGP can be uniformed.
Public/Granted literature
- US20110122649A1 Method And Structure For Uniforming Light Emitted From Backlight Module Public/Granted day:2011-05-26
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