Invention Grant
- Patent Title: Semiconductor light emitting device and method of fabricating semiconductor light emitting device
- Patent Title (中): 半导体发光器件及半导体发光器件的制造方法
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Application No.: US12874399Application Date: 2010-09-02
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Publication No.: US08390007B2Publication Date: 2013-03-05
- Inventor: Toru Gotoda , Takahiro Sato , Toshiyuki Oka , Shinya Nunoue , Kotaro Zaima
- Applicant: Toru Gotoda , Takahiro Sato , Toshiyuki Oka , Shinya Nunoue , Kotaro Zaima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-052214 20100309
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A semiconductor light emitting device has a light emitting element, and first and second electrodes. The light emitting element has a nitride-based III-V compound semiconductor on a substrate. The first and second electrodes are disposed on both sides of the light emitting element, respectively. The light emitting element has a light emitting layer, a first conductive type semiconductor layer, and a second conductive type semiconductor layer. The first conductive type semiconductor layer is disposed between the light emitting layer and the first electrode. The second conductive type semiconductor layer is disposed between the light emitting layer and the second electrode. One surface of the first conductive type semiconductor layer contacts the first electrode and is a light extraction surface which is roughly processed so as to have two or more kinds of oblique angles.
Public/Granted literature
- US20110220933A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2011-09-15
Information query
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