发明授权
- 专利标题: Integration of low and high voltage CMOS devices
- 专利标题(中): 集成低压和高压CMOS器件
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申请号: US13561710申请日: 2012-07-30
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公开(公告)号: US08390077B2公开(公告)日: 2013-03-05
- 发明人: Jan Sonsky , Anco Heringa
- 申请人: Jan Sonsky , Anco Heringa
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L27/088
- IPC分类号: H01L27/088
摘要:
A semiconductor device includes a semiconductor substrate having a first portion and a second portion and a first transistor of a first type formed in the first portion of the substrate, the first transistor being operable at a first voltage, and the first transistor including a doped channel region of a second type opposite of the first type. The semiconductor device also includes a second transistor of the second type formed in the second portion of the substrate, the second transistor being operable at a second voltage greater than the first voltage, the second transistor including an extended doped feature of the second type. Further, the semiconductor device includes a well of the first type in the semiconductor substrate under a gate of the second transistor, wherein the well does not extend directly under the extended doped feature and the extended doped feature does not extend directly under the well.
公开/授权文献
- US20120299112A1 Integration of Low and High Voltage CMOS Devices 公开/授权日:2012-11-29
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