发明授权
- 专利标题： Sealed air gap for semiconductor chip
- 专利标题（中）： 半导体芯片密封气隙
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申请号： US12914132申请日： 2010-10-28
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公开(公告)号： US08390079B2公开(公告)日： 2013-03-05
- 发明人: David V. Horak , Elbert E. Huang , Charles W. Koburger, III , Douglas C. La Tulipe, Jr. , Shom Ponoth
- 申请人： David V. Horak , Elbert E. Huang , Charles W. Koburger, III , Douglas C. La Tulipe, Jr. , Shom Ponoth
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Hoffman Warnick LLC
- 代理商 Richard M. Kotulak
- 主分类号： H01L27/088
- IPC分类号： H01L27/088
摘要：
A semiconductor chip including a substrate; a dielectric layer over the substrate; a gate within the dielectric layer, the gate including a sidewall; a contact contacting a portion of the gate and a portion of the sidewall; and a sealed air gap between the sidewall, the dielectric layer and the contact.
公开/授权文献
- US20120104512A1 SEALED AIR GAP FOR SEMICONDUCTOR CHIP 公开/授权日：2012-05-03
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