发明授权
- 专利标题: Heat spreader, electronic apparatus, and heat spreader manufacturing method
- 专利标题(中): 散热器,电子设备和散热器制造方法
-
申请号: US12536996申请日: 2009-08-06
-
公开(公告)号: US08391007B2公开(公告)日: 2013-03-05
- 发明人: Mitsuo Hashimoto , Kazuaki Yazawa , Yuichi Ishida , Hiroyuki Ryoson
- 申请人: Mitsuo Hashimoto , Kazuaki Yazawa , Yuichi Ishida , Hiroyuki Ryoson
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: K&L Gates LLP
- 优先权: JPP2008-206562 20080811
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; F28D15/02
摘要:
According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being arranged apart from and higher than the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion by a gravitational force.
公开/授权文献
信息查询