Invention Grant
- Patent Title: Ejector device of injection molding machine
- Patent Title (中): 注塑机喷射装置
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Application No.: US12803217Application Date: 2010-06-22
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Publication No.: US08393883B2Publication Date: 2013-03-12
- Inventor: Seiji Kimura
- Applicant: Seiji Kimura
- Applicant Address: JP Hyogo
- Assignee: Pascal Engineering
- Current Assignee: Pascal Engineering
- Current Assignee Address: JP Hyogo
- Agency: Jordan and Hamburg LLP
- Main IPC: B29C45/40
- IPC: B29C45/40

Abstract:
A burden of exchanging ejector rods is reduced in an injection molding machine when exchanging rods during exchange of a die. A plurality of rod insertion holes are formed so as to pierce through a movable platen. A plurality of ejector rods are inserted into rod insertion holes so as to slide freely therein. An ejector plate is disposed at the rear side of the movable platen. In a plurality of the ejector rods, a plurality of base rods are inserted into rod insertion holes so as to slide freely therein. Their base end portions are fixed to the ejector plate. Detachable rods are removably stuck with magnetism to the base rods by first and second magnets.
Public/Granted literature
- US20110311664A1 Ejector device of injection molding machine Public/Granted day:2011-12-22
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