发明授权
- 专利标题： Patterning process
- 专利标题（中）： 图案化过程
-
申请号： US12756587申请日： 2010-04-08
-
公开(公告)号： US08394577B2公开(公告)日： 2013-03-12
- 发明人: Akinobu Tanaka , Tamotsu Watanabe , Satoshi Watanabe
- 申请人： Akinobu Tanaka , Tamotsu Watanabe , Satoshi Watanabe
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2009-093719 20090408
- 主分类号： G03F7/26
- IPC分类号： G03F7/26
摘要：
In a chemically amplified resist composition comprising a base resin, an acid generator, and a solvent, 1,400-5,000 pbw of the solvent is present per 100 pbw of the base resin, and the solvent comprises at least 60 wt % of PGMEA and ethyl lactate, and 0.2-20 wt % of a high-boiling solvent. A resist pattern is formed by coating the resist composition on a substrate, prebaking, patternwise exposure, post-exposure baking, development, and heat treatment.
公开/授权文献
- US20100261123A1 PATTERNING PROCESS 公开/授权日：2010-10-14
信息查询
IPC分类:
