Invention Grant
- Patent Title: Integrated circuit module time delay budgeting
- Patent Title (中): 集成电路模块时间延迟预算
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Application No.: US13115858Application Date: 2011-05-25
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Publication No.: US08397197B1Publication Date: 2013-03-12
- Inventor: Mitrajit Chatterjee , Sandeep Badida
- Applicant: Mitrajit Chatterjee , Sandeep Badida
- Applicant Address: US CA San Diego
- Assignee: Applied Micro Circuits Corporation
- Current Assignee: Applied Micro Circuits Corporation
- Current Assignee Address: US CA San Diego
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A circuit analysis tool is provided, enabled as computer software instructions, for budgeting time delays between integrated circuit (IC) modules. The instructions accept a command enabling an IC floor-plan including a first module and a second module. The first module includes a first circuit element having a signal output interface, and an output port. The second module includes an input port, and a second circuit element having a signal input interface. A command is accepted defining a maximum delay value, and a first delay value is estimated between the first circuit element signal output interface and the first module output port. A second delay value is estimated between the second circuit element signal input interface and the second module input port, and a third delay value is estimated between the first module output port and the second module input port. The first, second, and third delay values are summed, creating a time budget estimate. The time budget estimate is approved if it is less than the maximum delay value.
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