发明授权
- 专利标题: Curable epoxy resin composition
- 专利标题(中): 可固化环氧树脂组合物
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申请号: US13404894申请日: 2012-02-24
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公开(公告)号: US08399577B2公开(公告)日: 2013-03-19
- 发明人: Bandeep Singh , Stéphane Schaal , Xavier Kornmann , Prateek Puri
- 申请人: Bandeep Singh , Stéphane Schaal , Xavier Kornmann , Prateek Puri
- 申请人地址: CH Zurich
- 专利权人: ABB Research Ltd
- 当前专利权人: ABB Research Ltd
- 当前专利权人地址: CH Zurich
- 代理机构: Buchanan Ingersoll & Rooney P.C.
- 主分类号: C08K3/36
- IPC分类号: C08K3/36 ; C08L63/02 ; H01B3/40 ; H01F27/32 ; H01L23/29
摘要:
A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.
公开/授权文献
- US20120202918A1 CURABLE EPOXY RESIN COMPOSITION 公开/授权日:2012-08-09
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