公开(公告)号：US08399577B2

公开(公告)日：2013-03-19

申请号：US13404894

申请日：2012-02-24

申请人： Bandeep Singh ,  Stéphane Schaal ,  Xavier Kornmann ,  Prateek Puri

发明人： Bandeep Singh ,  Stéphane Schaal ,  Xavier Kornmann ,  Prateek Puri

IPC分类号： C08K3/36 ,  C08L63/02 ,  H01B3/40 ,  H01F27/32 ,  H01L23/29

CPC分类号： C08G59/4284 ,  C08G59/58 ,  C08L63/00 ,  H01B3/40

摘要： A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

摘要翻译： 至少包含环氧树脂组分和硬化剂组分的可固化环氧树脂组合物，以及任选的其它添加剂，其中：（a）环氧树脂组分是环氧树脂化合物或这些化合物的混合物; （b）硬化剂组分包括（b1）脂族和脂环族或芳族聚碳酸酐; 和（b2）通式（I）的聚醚 - 胺，H2N-（CnH2n-O）m-CnH2n-NH2，其中n是2至8的整数; m为约3至约100; （c）聚碳酸酐[组分（b1）]以0.60Mol至0.93mol的浓度存在于可固化环氧树脂组合物中; 和（d）通式（I）[组分（b2）]的聚醚 - 胺以约0.02Mol至约0.1Mol的浓度存在于可固化环氧树脂组合物中。

公开(公告)号：US20120202918A1

公开(公告)日：2012-08-09

申请号：US13404894

申请日：2012-02-24

申请人： Bandeep SINGH ,  Stéphane Schaal ,  Xavier Kornmann ,  Prateek Puri

发明人： Bandeep SINGH ,  Stéphane Schaal ,  Xavier Kornmann ,  Prateek Puri

IPC分类号： H01B3/40 ,  C08K9/00 ,  C08L63/00

CPC分类号： C08G59/4284 ,  C08G59/58 ,  C08L63/00 ,  H01B3/40

摘要： A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

摘要翻译： 至少包含环氧树脂组分和硬化剂组分的可固化环氧树脂组合物，以及任选的其它添加剂，其中：（a）环氧树脂组分是环氧树脂化合物或这些化合物的混合物; （b）硬化剂组分包括（b1）脂族和脂环族或芳族聚碳酸酐; 和（b2）通式（I）的聚醚 - 胺，H2N-（CnH2n-O）m-CnH2n-NH2，其中n是2至8的整数; m为约3至约100; （c）聚碳酸酐[组分（b1）]以0.60Mol至0.93Mol的浓度存在于可固化环氧树脂组合物中; 和（d）通式（I）[组分（b2）]的聚醚 - 胺以约0.02Mol至约0.1Mol的浓度存在于可固化环氧树脂组合物中。

公开(公告)号：US20120208924A1

公开(公告)日：2012-08-16

申请号：US13383774

申请日：2009-07-14

申请人： Bandeep Singh ,  Cherif Ghoul ,  Stéphane Schaal ,  Prateek Puri

发明人： Bandeep Singh ,  Cherif Ghoul ,  Stéphane Schaal ,  Prateek Puri

IPC分类号： H01B3/40 ,  C07C69/753 ,  C08L63/00

CPC分类号： C08G59/4276

摘要： An exemplary curable epoxy resin composition is disclosed which includes at least an epoxy resin component and a hardener component, and optionally further additives, wherein (a) at least a part of the hardener component is a chemically modified polycarbonic acid anhydride; (b) an optional glycol or polyglycol; (c) or a compound containing two carboxylic groups is included; and (d) the chemically modified acid anhydride hardener is present in an amount comprising at least 10% of reactive hardening groups calculated to all the reactive hardening groups contained in the total amount of hardener component present in the epoxy resin composition.

摘要翻译： 公开了一种示例性的可固化环氧树脂组合物，其包括至少一种环氧树脂组分和一种硬化剂组分，以及任选的其它添加剂，其中（a）至少一部分该固化剂组分是化学改性的聚碳酸酐; （b）任选的二醇或聚二醇; （c）或含有两个羧基的化合物; 和（d）化学改性的酸酐硬化剂的存在量为至少10％的反应性硬化基团，其计算为环氧树脂组合物中存在的固化剂组分总量中包含的所有反应性硬化基团。

公开(公告)号：US08790476B2

公开(公告)日：2014-07-29

申请号：US12051169

申请日：2008-03-19

申请人： Uwe Kaltenborn ,  Guido Meier ,  Stéphane Schaal ,  Jens Rocks

发明人： Uwe Kaltenborn ,  Guido Meier ,  Stéphane Schaal ,  Jens Rocks

IPC分类号： B32B37/00

CPC分类号： B29C53/56 ,  B29C53/582 ,  B29C70/32 ,  B29C70/386 ,  B29L2009/003 ,  H01F27/323 ,  H01F27/327 ,  H01F41/063 ,  H01F41/122 ,  H01F41/127

摘要： Mold-free resin-insulated coil windings are obtained by applying continuous fibers embedded in a quasi-solid-state epoxy-resin matrix, e.g. in the form of a tape, to the coil windings. The tape is locally heated up to the melting point of its polymer matrix, and is subsequently pressed against the winding body. The heated and fused resin of the tape, which is pressed onto the coil, flows under pressure into the voids and gaps between the coil windings and fills them up, thereby hermetically insulating the coil windings. After leaving the heating and pressing apparatus the fused epoxy resin becomes solid again. The resulting curing process is thus considerably simplified and shortened, compared to the state of the art.

摘要翻译： 通过将嵌入准固态环氧树脂基质中的连续纤维，例如， 以带子的形式，到线圈绕组。 将带子局部加热到其聚合物基质的熔点，然后将其压靠在卷绕体上。 压制在线圈上的胶带的加热和熔融树脂在压力下流入空隙和线圈绕组之间的间隙并将其填充，从而使线圈绕组气密绝缘。 离开加热和加压装置后，熔融环氧树脂再次变成固体。 因此与现有技术相比，所得到的固化过程被大大简化和缩短。