Invention Grant
- Patent Title: Active device array substrate and method for fabricating the same
- Patent Title (中): 有源器件阵列衬底及其制造方法
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Application No.: US12943933Application Date: 2010-11-11
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Publication No.: US08399891B2Publication Date: 2013-03-19
- Inventor: Po-Lin Lai , Ying-Fa Huang , Chun-Ming Yang , Wen-Bin Wu , Wen-Yi Lin
- Applicant: Po-Lin Lai , Ying-Fa Huang , Chun-Ming Yang , Wen-Bin Wu , Wen-Yi Lin
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99127601A 20100818
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.
Public/Granted literature
- US20120043558A1 ACTIVE DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-02-23
Information query
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