发明授权
- 专利标题： Metal pad or metal bump over pad exposed by passivation layer
- 专利标题（中）： 通过钝化层暴露的金属焊盘或金属凸块
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申请号： US11461416申请日： 2006-07-31
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公开(公告)号： US08399989B2公开(公告)日： 2013-03-19
- 发明人: Mou-Shiung Lin , Hsin-Jung Lo , Chiu-Ming Chou , Chien-Kang Chou , Ke-Hung Chen
- 申请人： Mou-Shiung Lin , Hsin-Jung Lo , Chiu-Ming Chou , Chien-Kang Chou , Ke-Hung Chen
- 申请人地址： TW Hsinchu
- 专利权人： Megica Corporation
- 当前专利权人： Megica Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： Seyfarth Shaw LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A circuitry component comprising a semiconductor substrate, a pad over said semiconductor substrate, a tantalum-containing layer on a side wall and a bottom surface of said pad, a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad, a titanium-containing layer over said pad exposed by said opening, and a gold layer over said titanium-containing layer.
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