A display apparatus includes a display panel on which a pad part is formed, a driving chip including bumps making contact with the pad part, and a non-conductive adhesive film disposed between the display panel and the driving chip attaching the driving chip to the pad part. Each of the bumps includes a step-difference portion including a non-conductive elastic polymer and a bump line formed on the step-difference portion. The bump line is provided with a fine pattern through which a portion of the step-difference portion is exposed, and the bump line makes contact with the pad part. Accordingly, the reliability of the electrical connection between the driving chip and the display panel may be increased.