发明授权
- 专利标题: Wiring layer, semiconductor device and liquid crystal display device
- 专利标题(中): 接线层,半导体器件和液晶显示器件
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申请号: US13403145申请日: 2012-02-23
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公开(公告)号: US08400594B2公开(公告)日: 2013-03-19
- 发明人: Satoru Takasawa , Masanori Shirai , Satoru Ishibashi
- 申请人: Satoru Takasawa , Masanori Shirai , Satoru Ishibashi
- 申请人地址: JP Chigasaki-shi
- 专利权人: Ulvac, Inc.
- 当前专利权人: Ulvac, Inc.
- 当前专利权人地址: JP Chigasaki-shi
- 代理机构: Kratz, Quintos & Hanson, LLP
- 优先权: JP2009-198815 20090828
- 主分类号: G02F1/1335
- IPC分类号: G02F1/1335
摘要:
Provided is an electrode layer and a wiring layer, which are free from peeling from a glass substrate. A wiring layer and a gate electrode layer are constituted by an adhering film which is a thin film made of Cu—Mg—Al formed on a surface of a glass substrate, and a copper film formed on the adhering film. When the adhering film includes Mg in a range of at least 0.5 atom % and at most 5 atom %, and aluminum in a range of at least 5 atom % and at most 15 atom %, assuming that the total number of atoms of copper, magnesium and aluminum is taken as 100 atom %, adhesion of the adhering film to the glass substrate becomes high, and the copper thin film is not peeled from the glass substrate. The wiring layer is electrically connected to a pixel electrode of a liquid crystal display device.
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