发明授权
- 专利标题： Heat spreader, electronic apparatus, and heat spreader manufacturing method
- 专利标题（中）： 散热器，电子设备和散热器制造方法
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申请号： US12552794申请日： 2009-09-02
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公开(公告)号： US08400770B2公开(公告)日： 2013-03-19
- 发明人: Mitsuo Hashimoto , Kazuaki Yazawa , Yuichi Ishida , Hiroyuki Ryoson
- 申请人： Mitsuo Hashimoto , Kazuaki Yazawa , Yuichi Ishida , Hiroyuki Ryoson
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： K&L Gates, LLP
- 优先权： JP2008-224363 20080902
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F28F7/00 ; F28D15/02 ; B21D53/02
摘要：
According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.
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