Invention Grant
- Patent Title: Capacitor with direct DC connection to substrate
- Patent Title (中): 直接与基板直接连接的电容器
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Application No.: US11774329Application Date: 2007-07-06
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Publication No.: US08400775B2Publication Date: 2013-03-19
- Inventor: Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
- Applicant: Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
Public/Granted literature
- US20090009980A1 CAPACITOR WITH DIRECT DC CONNECTION TO SUBSTRATE Public/Granted day:2009-01-08
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