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公开(公告)号：US08400775B2
公开(公告)日：2013-03-19
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K1/18
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译： 为功率逆变器模块提供了一个子部件。 该装置包括具有端子并且集成到壳体中的电容器。 衬底安装在壳体上。 该基板包括功率半导体开关，并具有至少一个直流（DC）接头。 直流标签直接连接到电容器的端子。
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公开(公告)号：US20090009980A1
公开(公告)日：2009-01-08
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K7/00 , H02M7/5387 , H05K1/00
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译： 为功率逆变器模块提供一个子部件。 该装置包括具有端子并且集成到壳体中的电容器。 衬底安装在壳体上。 该基板包括功率半导体开关，并具有至少一个直流（DC）接头。 直流标签直接连接到电容器的端子。
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公开(公告)号：US08053920B2
公开(公告)日：2011-11-08
申请号：US12178897
申请日：2008-07-24
IPC分类号： B60L1/00
CPC分类号： H02M7/003 , H01L2224/49111
摘要： A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.
摘要翻译： 提供了一种用于功率转换器的端子组件。 端子组件包括第一和第二导电部件和电流传感器。 第一导电组件具有第一和第二可释放的附接结构。 第二导电部件具有相应的第一和第二宽度的第一和第二部分。 第一宽度小于第二宽度。 第一部分通过第二可释放的连接结构可释放地附接到第一导电部件。 电流传感器具有穿过其的开口并且位于第一导电部件和第二导电部件的第二部分之间，使得第一导电部件的第一部分延伸穿过开口。 电流传感器响应于流过第二导电部件的第一部分的电流。
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公开(公告)号：US07210304B2
公开(公告)日：2007-05-01
申请号：US11054483
申请日：2005-02-09
申请人： James M. Nagashima , Karl D. Conroy , Eric R. Ostrom , Gregory S. Smith , George John , David Tang , Terence G. Ward
发明人： James M. Nagashima , Karl D. Conroy , Eric R. Ostrom , Gregory S. Smith , George John , David Tang , Terence G. Ward
IPC分类号： F23D23/12
CPC分类号： F28D15/00 , B60K6/26 , B60K2001/003 , F28D15/0266 , H02K9/19 , H02K11/33 , H05K7/20936
摘要： In order to provide a modular arrangement, an inverter for an electric traction motor used to drive an automotive vehicle is positioned in proximity with the traction motor. The inverter is located within a compartment adjacent to one end of the electric traction motor and is cooled in a closed system by spraying a liquid coolant directly onto the inverter. The liquid coolant absorbs heat from the inverter and is cooled by a heat exchange arrangement comprising a reservoir with pipes carrying a second coolant from the radiator of the automotive vehicle. In a preferred embodiment, the coolant is collected from the inverter in an annular reservoir that is integral with the compartment containing the inverter. In accordance with one embodiment of the cooling arrangement, heat from the inverter vaporizes the liquid coolant by absorbing heat from the inverter during a phase change from a liquid to a vapor. The vaporized coolant is condensed by a circulating second coolant in pipes connected to the vehicle's radiator through a condenser that is preferably coaxial with the motor and the annular reservoir, which annular reservoir in the second embodiment collects overspray liquid coolant. In order to avoid degrading the inverter, the coolant is a dielectric fluid.
摘要翻译： 为了提供模块化布置，用于驱动机动车辆的电动牵引电动机的逆变器位于牵引电动机附近。 逆变器位于与电力牵引电动机的一端相邻的隔室内，并通过将液体冷却剂直接喷射到逆变器上而在封闭系统中冷却。 液体冷却剂从逆变器吸收热量，并且通过热交换装置来冷却，所述热交换装置包括具有从机动车辆的散热器承载第二冷却剂的管道的储存器。 在优选实施例中，冷却剂从与逆变器的隔室成一整体的环形容器中从逆变器收集。 根据冷却装置的一个实施例，来自逆变器的热量在从液体到蒸汽的相变期间通过吸收来自逆变器的热量来蒸发液体冷却剂。 蒸发的冷却剂通过连接到车辆散热器的管道中的循环第二冷却剂冷凝，该冷凝器优选地与电动机和环形储存器同轴，该第二实施例中的环形储存器收集过量喷射的液体冷却剂。 为了避免降低变频器，冷却剂是介质流体。
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公开(公告)号：US08462529B2
公开(公告)日：2013-06-11
申请号：US12178865
申请日：2008-07-24
IPC分类号： H02M7/537
CPC分类号： B60L11/14 , B60L3/003 , B60L3/0061 , B60L11/00 , B60L15/007 , B60L2240/36 , H01L25/18 , H01L2924/0002 , H02K11/048 , Y02T10/641 , Y02T10/645 , Y02T10/70 , Y02T10/7077 , H01L2924/00
摘要： A power converter assembly is provided. The power converter assembly includes first, second, and third power modules. The second power module is coupled to the first power module such that the second power module is separated from the first power module by a first distance. The third power module is coupled to the first and second power modules such that the third power module is separated from the second power module by a second distance and is separated from the first power module by a third distance. The first, second, and third distances are substantially the same.
摘要翻译： 提供功率转换器组件。 功率转换器组件包括第一，第二和第三功率模块。 第二功率模块耦合到第一功率模块，使得第二功率模块与第一功率模块分离第一距离。 第三功率模块耦合到第一和第二功率模块，使得第三功率模块与第二功率模块分离第二距离并且与第一功率模块分离第三距离。 第一，第二和第三距离基本相同。
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公开(公告)号：US08169779B2
公开(公告)日：2012-05-01
申请号：US12638683
申请日：2009-12-15
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L25/072 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
摘要翻译： 为适用于直接基板冷却的电力电子基板提供系统和装置。 电力电子基板包括被配置为具有设置在其上的电路的第一表面，第二表面和第二表面上的多个物理特征。 物理特征被配置为促进撞击在第二表面上的冷却剂中的湍流边界层。
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公开(公告)号：US07973433B2
公开(公告)日：2011-07-05
申请号：US12178847
申请日：2008-07-24
申请人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
发明人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
CPC分类号： B60K6/48 , B60K2001/003 , B60L2240/36 , H01L24/48 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/12041 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/19105 , H05K7/20854 , Y02T10/6221 , Y10T307/944 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; and gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die.
摘要翻译： 电源开关装置包括：基板; 安装在基板上的半导体管芯，并且包括用于高功率，交流电动机应用的电力电子电路; 以及栅极驱动电路，其安装在所述基板上并电耦合到所述半导体管芯上的所述电力电子电路。
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公开(公告)号：US08139371B2
公开(公告)日：2012-03-20
申请号：US12178478
申请日：2008-07-23
申请人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
发明人： David F. Nelson , George John , Gregory S. Smith , David Tang , James M. Nagashima , Gabriel Gallegos-Lopez
IPC分类号： H05K7/00
CPC分类号： H03K17/567 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/3025 , H05K1/181 , H05K3/4061 , H05K7/1432 , H05K7/20936 , H05K2201/0723 , H05K2201/10166 , H05K2203/1572 , Y02P70/611 , H01L2924/00012 , H01L2924/00
摘要： A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die; and control circuitry mounted on the substrate and electrically coupled to the gate drive circuitry.
摘要翻译： 电源开关装置包括：基板; 安装在基板上的半导体管芯，并且包括用于高功率，交流电动机应用的电力电子电路; 栅极驱动电路，其安装在所述衬底上并电耦合到所述半导体管芯上的所述电力电子电路; 以及安装在基板上并电耦合到栅极驱动电路的控制电路。
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公开(公告)号：US07450378B2
公开(公告)日：2008-11-11
申请号：US11552564
申请日：2006-10-25
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.
摘要翻译： 半导体模块包括其中具有空腔的壳体和位于空腔内的至少一个半导体器件。 冷却系统被容纳在壳体内并且包括设置在壳体内的介电流体和设置穿过壳体的流动通道。 流动通道流体地联接到空腔，并且冷却系统被配置为使介电流体通过流动通道循环到至少一个半导体器件上。
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公开(公告)号：US20080101013A1
公开(公告)日：2008-05-01
申请号：US11552564
申请日：2006-10-25
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.
摘要翻译： 半导体模块包括其中具有空腔的壳体和位于空腔内的至少一个半导体器件。 冷却系统被容纳在壳体内并且包括设置在壳体内的介电流体和设置穿过壳体的流动通道。 流动通道流体地联接到空腔，并且冷却系统被配置为使介电流体通过流动通道循环到至少一个半导体器件上。
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