Invention Grant
- Patent Title: Highly dilutable polishing concentrates and slurries
- Patent Title (中): 高度可稀释的抛光浓缩液和浆液
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Application No.: US13402365Application Date: 2012-02-22
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Publication No.: US08404143B2Publication Date: 2013-03-26
- Inventor: Hyungjun Kim , Richard Wen , Bin Hu , Minae Tanaka , Deepak Mahulikar
- Applicant: Hyungjun Kim , Richard Wen , Bin Hu , Minae Tanaka , Deepak Mahulikar
- Applicant Address: US MI Adrian
- Assignee: Fujifilm Planar Solutions, LLC
- Current Assignee: Fujifilm Planar Solutions, LLC
- Current Assignee Address: US MI Adrian
- Agency: Ohlandt, Greeley, Ruggiero & Perle, LLP
- Main IPC: C09K13/00
- IPC: C09K13/00

Abstract:
The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.
Public/Granted literature
- US20120145951A1 HIGHLY DILUTABLE POLISHING CONCENTRATES AND SLURRIES Public/Granted day:2012-06-14
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