发明授权
- 专利标题： Integrated circuit packaging system with package stacking and method of manufacture thereof
- 专利标题（中）： 具有封装堆叠的集成电路封装系统及其制造方法
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申请号： US12636779申请日： 2009-12-13
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公开(公告)号： US08404518B2公开(公告)日： 2013-03-26
- 发明人: Byung Tai Do , Rui Huang , Reza Argenty Pagaila
- 申请人： Byung Tai Do , Rui Huang , Reza Argenty Pagaila
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/52 ; H01L27/146
摘要：
A method of manufacture of an integrated circuit packaging system including: fabricating a base package substrate having component pads and stacking pads; coupling a base integrated circuit die to the component pads; forming a penetrable encapsulation material for enclosing the base integrated circuit die and the component pads on the base package substrate; and coupling stacked interconnects on the stacking pads adjacent to and not contacting the penetrable encapsulation material.
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