A flex-rigid wiring board including an insulative substrate having a wiring layer which is formed on the insulative substrate and includes a conductor, a flexible wiring board positioned beside the insulative substrate and having a wiring layer, the wiring layer of the flexible wiring board including a conductor and being contained inside the flexible wiring board, and a first insulation layer positioned on the insulative substrate and the flexible wiring board such that a portion of the flexible wiring board is left exposed from the first insulation layer. The first insulation layer has a wiring layer which is formed on the first insulation layer and includes a conductor. The wiring layer of the first insulation layer has a thickness which is formed thicker than a thickness of the wiring layer of the flexible wiring board and a thickness of the wiring layer of the insulative substrate.