Invention Grant
US08405094B2 Encapsulation substrate for an organic light emitting diode display device
有权
用于有机发光二极管显示装置的封装衬底
- Patent Title: Encapsulation substrate for an organic light emitting diode display device
- Patent Title (中): 用于有机发光二极管显示装置的封装衬底
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Application No.: US12827022Application Date: 2010-06-30
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Publication No.: US08405094B2Publication Date: 2013-03-26
- Inventor: Ji-Hun Ryu , Seung-Yong Song , Young-Seo Choi , Oh-June Kwon , Kwan-Hee Lee
- Applicant: Ji-Hun Ryu , Seung-Yong Song , Young-Seo Choi , Oh-June Kwon , Kwan-Hee Lee
- Applicant Address: KR Giheung-Gu, Yongin, Gyeonggi-Do
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Giheung-Gu, Yongin, Gyeonggi-Do
- Agent Robert E. Bushnell, Esq.
- Priority: KR10-2009-0072805 20090807
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
An organic light emitting diode (OLED) display device and method of fabrication that includes a substrate having a device region, an outer dam region and an encapsulation region. The encapsulation region includes an inner dam region, an outer dam region and an encapsulation region that correspond to the device region. An encapsulation agent is formed in the encapsulation region of the encapsulation substrate, and filling dams are formed of the same material in the outer dam region and the inner dam region of the encapsulation substrate.
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