Abstract:
An organic light emitting diode display having a display panel comprising a first substrate and a second substrate disposed facing the first substrate, the first substrate comprising a display area and a pad area, a buffer member disposed on one surface of the first substrate, the buffering member having a buffer layer and an adhesive layer formed on at least one surface of the buffer layer, and a bezel or a case accommodating the display panel and buffer member.
Abstract:
An organic light emitting diode display includes a first substrate, the first substrate including at least one organic light emitting diode and a pixel defining layer having an opening portion defining a light emitting region of the organic light emitting diode, protruding portions increasingly protruding on the pixel defining layer as the protruding portions approach the edges of the first substrate, a second substrate disposed opposite to the first substrate, a sealing member bonding the first substrate to the second substrate, and filler in a space between the first substrate and the second substrate.
Abstract:
An organic light-emitting diode display device includes a substrate, a display unit on the substrate, a touch unit facing the substrate, and a sealing portion surrounding the display unit. The sealing portion couples the substrate to the touch unit and includes glass frit. The touch unit includes an encapsulation substrate, a first conductive layer on the encapsulation substrate, an insulating layer on a portion of the first conductive layer and the encapsulation substrate, and a second conductive layer on the first conductive layer and the insulating layer. The insulating layer of the touch unit includes an organosilicon compound and has a thermal decomposition temperature of about 360° C. or more.
Abstract:
A silicon composition with a silicon compound represented by Formula 1 and a silicon compound represented by Formula 2: wherein, R1, R2, R3, R4, R11, R12, R13, R14, R15, R16, R17, R18, and R19 are each independently a C1-C4 alkyl group, R5, R6, R7, R8, R9, and R10 are each independently hydrogen or deuterium, k, m, and n are positive integers, and the ratio of k to the sum of m and n is from about 1:0.001 to about 1:0.2; and an organic light emitting device including the same.
Abstract:
A laser irradiation apparatus for bonding a first substrate to a second substrate using bonding members and a method of manufacturing a display device using the same, the laser irradiation apparatus including a stage on which the first substrate is mounted, bonding members disposed between the first substrate and the second substrate, a laser oscillating member configured to irradiate a laser beam onto the bonding members, and a temperature maintaining member co-operating with the first substrate to maintain a temperature of the first substrate at a predetermined temperature.
Abstract:
An organic light emitting device display includes a substrate, an organic light emitting diode array on the substrate, an encapsulation substrate on the organic light emitting diode array, and an internal filler between the organic light emitting diode array and the encapsulation substrate, the internal filler including a cross-linked silicone polymer.
Abstract:
A method for manufacturing an organic light emitting display. Pixel portions are formed on a mother substrate. A test wiring for testing pixel portions is formed at a peripheral portion of the mother substrate. A sealing material is formed at one surface of a sealing substrate to enclose the pixel portions, the sealing substrate being sealed to be spaced apart from the mother substrate. A spacer is formed at a side region of the one surface of the sealing substrate on which the sealing material is formed. The mother substrate and the sealing substrate are adhered to each other by the sealing material to seal the pixel portions within an enclosure formed by the mother substrate, sealing surface, and sealing material. A part of the sealing substrate is scribed and removed to expose the test wiring, the part of sealing substrate being arranged over a portion of the test wiring.
Abstract:
Provided are an organic light emitting apparatus and a method of manufacturing the same. The organic light emitting apparatus includes: a filling material between a diode substrate on which an organic light emitting unit is formed and an encapsulation substrate; and an organic protection layer that is interposed between the organic light emitting unit and the filling material and includes at least one thermally depositable organic material.
Abstract:
Provided is a flat panel display apparatus including a sealant which has a small effective width and is able to effectively attach a substrate and an encapsulation substrate. The flat panel display apparatus includes the substrate, a display unit disposed on the substrate, the encapsulation substrate disposed facing the substrate so that the display unit is disposed on inner side of the encapsulation substrate, and the sealant attaching the substrate and the encapsulation substrate, wherein an end surface of the sealant facing the substrate contacts a silicon oxide layer disposed on the substrate.
Abstract:
An organic light emitting display apparatus and a method of manufacturing the organic light emitting display apparatus are disclosed. In one embodiment, the organic light emitting display apparatus includes: i) a substrate, ii) a display unit formed on the substrate, iii) an encapsulation substrate formed over the display unit, iv) a sealant bonding the substrate and the encapsulation substrate and v) a filler formed in the space defined by i) the substrate, ii) the sealant and iii) the encapsulation substrate, wherein the filler comprises a first region and a second region which have different levels of hardness.