Invention Grant
- Patent Title: Electronic device with supporting apparatus
- Patent Title (中): 带支持装置的电子设备
-
Application No.: US13198730Application Date: 2011-08-05
-
Publication No.: US08406011B2Publication Date: 2013-03-26
- Inventor: Guang-Yao Lee , Yi-Sheng Lin , Bin Li
- Applicant: Guang-Yao Lee , Yi-Sheng Lin , Bin Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110051788 20110304
- Main IPC: H05K7/02
- IPC: H05K7/02

Abstract:
A support for an electronic device includes a mounting apparatus and a supporting apparatus. The mounting apparatus includes a fixing bracket mounted to the main body of an electronic device, an engaging member slidably mounted to the fixing bracket, and a resilient member connected between the fixing bracket and the engaging member. The supporting apparatus includes a connecting bracket detachably mounted to the fixing bracket. When the engaging member is slid relative to the fixing bracket, a stop piece moves away from the connecting hole, and a hook extends through the connecting hole. After the engaging member is released the stop piece moves to the connecting hole to engage with the hook.
Public/Granted literature
- US20120224350A1 ELECTRONIC DEVICE WITH SUPPORTING APPARATUS Public/Granted day:2012-09-06
Information query