Invention Grant
- Patent Title: Sutureless implantable medical device fixation
- Patent Title (中): 无缝线植入式医疗器械固定
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Application No.: US11413071Application Date: 2006-04-27
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Publication No.: US08406901B2Publication Date: 2013-03-26
- Inventor: Warren L. Starkebaum , Daniel J. Stetson , Eric H. Bonde
- Applicant: Warren L. Starkebaum , Daniel J. Stetson , Eric H. Bonde
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/05
- IPC: A61N1/05
Abstract:
A device comprises a medical implant and an actively deployable clip attached to the medical implant that operates to restrict movement of the medical implant once the actively deployable clip is deployed within a body of a patient. In some embodiments, the medical implant is an electrical lead for electrical stimulation. The actively deployable clip is operable to fixate the medical implant to a body tissue once deployed, such that the actively deployable clip performs a similar function to a suture. In this manner, embodiments of the invention may provide a medical implant that requires few or even no sutures to properly fixate the implant within the patient.
Public/Granted literature
- US20070255295A1 Sutureless implantable medical device fixation Public/Granted day:2007-11-01
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