发明授权
- 专利标题: Method for reducing contact resistance of a thermally and electrically conductive structure comprising carbon nanotube
- 专利标题(中): 包含碳纳米管的导热和导电结构的接触电阻降低的方法
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申请号: US13371575申请日: 2012-02-13
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公开(公告)号: US08409665B2公开(公告)日: 2013-04-02
- 发明人: Linda A. Shekhawat , Nachiket R. Raravikar
- 申请人: Linda A. Shekhawat , Nachiket R. Raravikar
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理商 Kenneth A. Nelson
- 主分类号: B05D1/36
- IPC分类号: B05D1/36 ; B05D3/02 ; B05D7/00 ; C08F2/01 ; B32B5/16
摘要:
A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
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