发明授权
- 专利标题： Electronic device and method for manufacturing thereof
- 专利标题（中）： 电子装置及其制造方法
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申请号： US12975065申请日： 2010-12-21
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公开(公告)号： US08410561B2公开(公告)日： 2013-04-02
- 发明人: Akira Sato , Toru Watanabe , Shogo Inaba , Takeshi Mori
- 申请人： Akira Sato , Toru Watanabe , Shogo Inaba , Takeshi Mori
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2006-302478 20061108
- 主分类号： H01L31/00
- IPC分类号： H01L31/00
摘要：
An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.
公开/授权文献
- US20110089521A1 Electronic Device and Method For Manufacturing Thereof 公开/授权日：2011-04-21
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