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US08415091B2 Water mark defect prevention for immersion lithography 有权
浸渍光刻防水标识缺陷

Water mark defect prevention for immersion lithography
Abstract:
A photoresist material having a polymer that turns soluble to a base solution in response to reaction with acid. The material includes a photo-acid generator (PAG) that decomposes to form acid in response to radiation energy and a quencher capable of neutralizing acid and having a reduced mobility. The photoresist material can thereby prevent water mark defects from immersion lithography.
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