发明授权
US08415219B2 Method of manufacturing a DMOS trench transistor 有权
制造DMOS沟槽晶体管的方法

Method of manufacturing a DMOS trench transistor
摘要:
To attain a comparatively high breakdown voltage at a high avalanche strength and with the physical size simultaneously being as small as possible, the invention proposes constructing a transistor device in a semiconductor material region in which a first source/drain region is used as a source region and in which the source region has a comparatively reduced surface charge or surface charge density.
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