发明授权
- 专利标题: Method of manufacturing a DMOS trench transistor
- 专利标题(中): 制造DMOS沟槽晶体管的方法
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申请号: US11638612申请日: 2006-12-13
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公开(公告)号: US08415219B2公开(公告)日: 2013-04-09
- 发明人: Franz Hirler , Helmut Strack
- 申请人: Franz Hirler , Helmut Strack
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Dicke, Billig & Czaja, PLLC
- 优先权: DE10239861 20020829
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
To attain a comparatively high breakdown voltage at a high avalanche strength and with the physical size simultaneously being as small as possible, the invention proposes constructing a transistor device in a semiconductor material region in which a first source/drain region is used as a source region and in which the source region has a comparatively reduced surface charge or surface charge density.
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