发明授权
- 专利标题： Chip identification for organic laminate packaging and methods of manufacture
- 专利标题（中）： 有机层压包装的芯片识别和制造方法
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申请号： US12756284申请日： 2010-04-08
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公开(公告)号： US08415260B2公开(公告)日： 2013-04-09
- 发明人: Albert J. Banach , Timothy H. Daubenspeck , Wolfgang Sauter
- 申请人： Albert J. Banach , Timothy H. Daubenspeck , Wolfgang Sauter
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Roberts Mlotkowski Safran & Cole, P.C.
- 代理商 Anthony Canale
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A chip identification for organic laminate packaging and methods of manufacture is provided. The method includes forming a material on a wafer which comprises a plurality of chips. The method further includes modifying the material to provide a unique identification for each of the plurality of chips on the wafer. The organic laminate structure includes a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip.
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