发明授权
- 专利标题： Integrated circuits having interconnects and heat dissipators based on nanostructures
- 专利标题（中）： 具有基于纳米结构的互连和散热器的集成电路
-
申请号： US13476417申请日： 2012-05-21
-
公开(公告)号： US08415787B2公开(公告)日： 2013-04-09
- 发明人: Mohammad Shafiqul Kabir
- 申请人： Mohammad Shafiqul Kabir
- 申请人地址： SE Göteborg
- 专利权人： Smoltek AB
- 当前专利权人： Smoltek AB
- 当前专利权人地址： SE Göteborg
- 代理机构： Fish & Richardson P.C.
- 优先权： SE0501888 20050826
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
The present invention relates to a heat dissipator that includes a conductive substrate and a plurality of nanostructures supported by the conductive substrate. The nanostructures are at least partly embedded in an insulator. Each of the nanostructures includes a plurality of intermediate layers on the conductive substrate. At least two of the plurality of intermediate layers are interdiffused, and material of the at least two of the plurality of intermediate layers that are interdiffused is present in the nanostructure.
公开/授权文献
信息查询
IPC分类:
