Invention Grant
- Patent Title: Bimetallic leaf spring clamping device
- Patent Title (中): 双金属片弹簧夹紧装置
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Application No.: US12598111Application Date: 2008-04-30
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Publication No.: US08418342B2Publication Date: 2013-04-16
- Inventor: Robert Dell , Chih-Shing Wei , Tae Young Lee
- Applicant: Robert Dell , Chih-Shing Wei , Tae Young Lee
- Applicant Address: US NY New York
- Assignee: Cooper Union for the Advancement of Science
- Current Assignee: Cooper Union for the Advancement of Science
- Current Assignee Address: US NY New York
- Agency: Goodwin Procter LLP
- International Application: PCT/US2008/061983 WO 20080430
- International Announcement: WO2008/134709 WO 20081106
- Main IPC: B23P11/02
- IPC: B23P11/02 ; A41F1/00
Abstract:
The invention relates to bimetallic leaf spring devices (100) that are responsive to changes in temperature, and methods of constructing and utilizing such devices. In one embodiment, the invention includes a clamping apparatus including a first strip (110) of a first material and a second strip (120) of a second material. The second strip (120) may be attached to the first strip (110) at least two attachment locations. The second strip (120) may be spaced apart from the first strip (110) at least one section between the at least two attachment locations, and at least one of the first material and the second material may include a thermally expansive material.
Public/Granted literature
- US20100199485A1 BIMETALLIC LEAF SPRING CLAMPING DEVICE Public/Granted day:2010-08-12
Information query
