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发明授权
US08421198B2 Integrated circuit package system with external interconnects at high density 有权
具有高密度外部互连的集成电路封装系统

Integrated circuit package system with external interconnects at high density
摘要：
An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.
摘要（中）：

集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

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