发明授权
- 专利标题： Integrated circuit packaging system with flex tape and method of manufacture thereof
- 专利标题（中）： 具有柔性带的集成电路封装系统及其制造方法
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申请号： US12717085申请日： 2010-03-03
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公开(公告)号： US08421202B2公开(公告)日： 2013-04-16
- 发明人: Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan
- 申请人： Il Kwon Shim , Seng Guan Chow , Heap Hoe Kuan
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a device to the substrate; providing interconnects on the substrate; and forming a flexible tape substantially conformal to the device and contacting the interconnects.