发明授权
- 专利标题: Structural migration of integrated circuit layout
- 专利标题(中): 集成电路布局的结构迁移
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申请号: US13205186申请日: 2011-08-08
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公开(公告)号: US08423941B2公开(公告)日: 2013-04-16
- 发明人: Fook-Luen Heng , Rajiv V. Joshi , Alexey Y. Lvov , Xiaoping Tang
- 申请人: Fook-Luen Heng , Rajiv V. Joshi , Alexey Y. Lvov , Xiaoping Tang
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Tutunjian & Bitetto, P.C.
- 代理商 Preston Young
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
Methods and systems for migrating circuit layouts. A floorplan layout is built for a target circuit using a subset of constraints that characterize a layout structure of an original circuit. Shape-constraint-based scaling is used on the floorplan layout by scaling parts of the floorplan layout in accordance with a plurality of different scaling ratios such that portions of the floorplan layout are concurrently scaled with the plurality of different scaling ratios. Cells are placed at locations defined by the floorplan layout. The floorplan layout is checked with shape-constraint-based legalization using all of the constraints to produce a migrated layout.
公开/授权文献
- US20130042217A1 STRUCTURAL MIGRATION OF INTEGRATED CIRCUIT LAYOUT 公开/授权日:2013-02-14
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