发明授权
US08426953B2 Semiconductor package with an embedded printed circuit board and stacked die
有权
半导体封装带有嵌入式印刷电路板和堆叠裸片
- 专利标题： Semiconductor package with an embedded printed circuit board and stacked die
- 专利标题（中）： 半导体封装带有嵌入式印刷电路板和堆叠裸片
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申请号： US13227802申请日： 2011-09-08
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公开(公告)号： US08426953B2公开(公告)日： 2013-04-23
- 发明人: Yong Liu , Margie T. Rios , Hua Yang , Yumin Liu , Tiburcio A. Maldo
- 申请人： Yong Liu , Margie T. Rios , Hua Yang , Yumin Liu , Tiburcio A. Maldo
- 申请人地址： US ME South Portland
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US ME South Portland
- 代理机构： Hiscock & Barclay, LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A two tier power module has, in one form thereof, a PC board having upper and lower traces with an opening in the insulating material that contains a power device which has upward extending solder bump connections. An upper leadframe is mounted on the solder bumps and the upper tracks of the PC board. Vias in the PC board connect selected upper and lower traces. A control device is mounted atop the leadframe and wire bonded to the leadframe, and the assembly is encapsulated leaving exposed the bottom surfaces of the lower traces of the PC board as external connections. In another form the PC board is replaced by a planar leadframe and the upper leadframe has stepped sections which make connections with the planar leadframe, the bottom surfaces of the planar leadframe forming external connections of the module.
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